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1
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MOXRKELS2604566
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12'' RECLAIM WAFER - CU12'' RECLAIM WAFER - CU (<100@0.20UM)PO: XXXXXXXXXX#STOR260514103512#STOR260514103712#STOR26051403848#STOR260514103435#STOR260514103638INV NO.230-2026060022-23
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APPLIED MATERIALS (TPO DEPT.)
|
SCIENTECH CORPORATION
|
2026-07-14
|
China Taiwan
|
2610 Kgs
|
216 CTN
|
|
2
|
MOXRKELS2603262
|
12 RECLAIM WAFER - CU 12 RECLAIM WAFER - CU (<100@0.20UM) PO: XXXXXXXXXX #STOR260320062232 #STOR260320062348#STOR260320062259#STOR260320062404INV NO.230-2026040150-151
|
APPLIED MATERIALS (TPO DEPT.)
|
SCIENTECH CORPORATION
|
2026-06-01
|
China Taiwan
|
1740 Kgs
|
144 CTN
|
|
3
|
MOXRKELS2507610
|
PD E A(WAF ) RECLAIM WAFERSILICON SEMICONDUCTOR, BLANKSILICON WAFER(NOT SELECTIVELY DOPED OR FUSED)
|
APPLIED MATERIALS (TPO DEPT.)
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SCIENTECH CORPORATION
|
2025-11-05
|
China Taiwan
|
435 Kgs
|
36 CTN
|
|
4
|
MOXRKELS2505688
|
RECLAIM WAFER SILICON SEMICONDUCTOR, BLANKSILICON WAFER (NOT SELECTIVELY DOPED OR FUSED)
|
APPLIED MATERIALS (TPO DEPT.)
|
SCIENTECH CORPORATION
|
2025-08-31
|
China Taiwan
|
435 Kgs
|
36 CTN
|
|
5
|
MOXRSELS2501437
|
7 CARTONS OFMACHINES FOR DEPOSITING MEMBRANCEMINI MCXT, HYDRA TIN,CVD TI(3CHAMBER)CVD CHAMBERINV NO:ED50820533HS CODE:848620
|
APPLIED MATERIALS (TPO DEPT.)
|
SAMSUNG ELECTRONICS CO., LTD
|
2025-06-29
|
South Korea
|
3920 Kgs
|
7 CTN
|