|
1
|
TXSLSPMYAN260324
|
CTNS=PLTS HEAT SINK
|
DIGI-KEY CORPORATION
|
BOYD (SHENZHEN) SYSTEMS CO., LTD
|
2026-04-08
|
China
|
456 Kgs
|
48 CTN
|
|
2
|
DMALHKGC66222
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-03-17
|
Hong Kong
|
312 Kgs
|
65 CTN
|
|
3
|
DMALSZXD32658
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-03-09
|
China
|
2085 Kgs
|
5 PKG
|
|
4
|
DMALHKGC65659
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-03-09
|
Hong Kong
|
280 Kgs
|
38 CTN
|
|
5
|
DMALHKGC63920
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-02-09
|
Hong Kong
|
1014 Kgs
|
114 CTN
|
|
6
|
DMALSZXD24816
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-01-26
|
China
|
566 Kgs
|
2 PKG
|
|
7
|
DMALHKGC63034
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-01-24
|
Hong Kong
|
155 Kgs
|
15 CTN
|
|
8
|
DMALSZXD26835
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-01-19
|
China
|
2085 Kgs
|
5 PKG
|
|
9
|
DMALHKGC62627
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-01-18
|
Hong Kong
|
370 Kgs
|
62 CTN
|
|
10
|
DMALSZXD23759
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2026-01-04
|
China
|
2651 Kgs
|
7 PKG
|