|
1
|
DMALSZXD41943
|
HEAT SINK
|
BOYD CORPORATION
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-04-14
|
China
|
6571 Kgs
|
763 CTN
|
|
2
|
TGFHTHKG7411478
|
CTNS/PHEAT SINK HS CODE: INV:
|
ADVANCED ENERGY INDUSTRIES INC.
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-04-14
|
Hong Kong
|
1666 Kgs
|
63 CTN
|
|
3
|
MCLMHKLGB2603011
|
HEAT SINK HS CODE BOYD INV CARTONS PACKED IN PLASTIC PALLET THIS SH IPMENT CONTAINS NO WOOD PACKING MATERIAL
|
N/A
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-04-14
|
Hong Kong
|
89 Kgs
|
10 CTN
|
|
4
|
KWEO520047326535
|
HEAT SINK
|
WISTRON INFOCOMM TECHNOLOGY
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-04-14
|
Hong Kong
|
258 Kgs
|
40 CTN
|
|
5
|
MCLMHKLGB2603010
|
HEAT SINK HS CODE BOYD INV CARTONS PACKED IN PLYWO OD PALLET THIS SHIPMENT CONTAINS NO WOOD PACKING MATERIAL
|
N/A
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-04-14
|
Hong Kong
|
238 Kgs
|
20 CTN
|
|
6
|
FTNVSSZXS0013513
|
HEAT SINK
|
TENSTORRENT INC
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-04-14
|
China
|
940 Kgs
|
130 CTN
|
|
7
|
BOPTCNSZN1011462
|
HEAT SINK HTS CODE:..
|
N/A
|
BOYD (SHENZHEN) THERMAL SYSTEMS CO.
|
2026-04-09
|
Hong Kong
|
310 Kgs
|
27 CTN
|
|
8
|
TGFHTHKG7400392
|
HEAT SINK HS CODE: INV: CTNS/P
|
SL POWER ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-04-07
|
Hong Kong
|
564 Kgs
|
68 CTN
|
|
9
|
KWEO520047324391
|
HEAT SINK
|
WISTRON INFOCOMM TECHNOLOGY
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-04-07
|
Hong Kong
|
838 Kgs
|
84 CTN
|
|
10
|
DMALSZXD39881
|
HEAT SINK
|
BOYD CORPORATION
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-03-31
|
China
|
5898 Kgs
|
658 CTN
|