|
1
|
AMIGCSZ26042288
|
TOTAL: 17CTNS=1PALLET HEAT SINK HS CODE: 8473305100 BOYD INV#XXXXXXX NON-STACK VOLUME:2.57 CBM THIS SHIPMENT CONTAINS NO WOOD PACKAGING MATERIALS.
|
BIAMP SYSTEMS
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-06-07
|
China
|
280 Kgs
|
17 CTN
|
|
2
|
HYSLXSZX05261369
|
HEATSINK HS CODE: 8473305100
|
INVENTEC IEC TECHNOLOGIES
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-06-02
|
Hong Kong
|
3697 Kgs
|
16 PKG
|
|
3
|
DMALSZXD50098
|
HEAT SINK
|
BOYD CORPORATION
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-05-31
|
China
|
3662 Kgs
|
453 CTN
|
|
4
|
CHSL548790112SZN
|
ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION
|
SURE POWER INC A DIVISION OF COOPER
|
BOYD SHENZHEN THERMAL SYSTEMS LTD
|
2026-05-22
|
China Taiwan
|
2434 Kgs
|
240 PKG
|
|
5
|
SHPTPHKS01527387
|
HEAT SINK HS CODE 8473305100
|
AVNET, INC.
|
BOYD SHENZHEN THERMAL SYSTEMS LTD
|
2026-05-19
|
Hong Kong
|
179 Kgs
|
26 CTN
|
|
6
|
TGFHTHKG7445279
|
77CTNS/2PHEAT SINK HS CODE:8473305100 INV:XXXXXXX 4807677 4807679
|
SL POWER ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-05-19
|
Hong Kong
|
712 Kgs
|
77 CTN
|
|
7
|
BWLEHKG69778037
|
20CTNS PACKED INTO 1PLTHEAT SINK HS:8473305100 BOYD INV#XXXXXXX THIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIAL
|
KIMBALL ELECTRONICS MEXICO INC
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-05-19
|
Hong Kong
|
274 Kgs
|
20 CTN
|
|
8
|
FTNVSSZXS0014243
|
HEAT SINK
|
TENSTORRENT INC
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-05-16
|
China
|
1254 Kgs
|
180 CTN
|
|
9
|
DMALSZXD47130
|
HEAT SINK
|
BOYD CORPORATION
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2026-05-12
|
China
|
6399 Kgs
|
787 CTN
|
|
10
|
NAQAPLAX6865647V
|
84 CTNS CONTAIN 3 PLTS HEAT SINK HS CODE 8473 30 9000 BOYD INV 4804268
|
HARDWARE SPECIALTY CO LTD
|
BOYD SHENZHEN THERMAL SYSTEMS LTD
|
2026-05-12
|
China
|
956 Kgs
|
84 CTN
|