|
1
|
EXDO6810981247
|
MOLD TEMPERATURE CONTROLLER HTS:
|
N/A
|
E&R ENGINEERING CORPORATION
|
2026-04-03
|
China Taiwan
|
2716 Kgs
|
2 WDC
|
|
2
|
EXDO6810980515
|
WAFER EFEM FOR WAFER POST CURE OVEN HTS:
|
N/A
|
E&R ENGINEERING CORPORATION
|
2026-03-19
|
China
|
1827 Kgs
|
2 WDC
|
|
3
|
EXDO6810979749
|
MOLD TEMPERATURE CONTROLLER HTS:
|
N/A
|
E&R ENGINEERING CORPORATION
|
2026-03-09
|
China Taiwan
|
8723 Kgs
|
7 WDC
|
|
4
|
NXGWKHHDGV94553
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
INTEL C/O RINCHEM
|
E&R ENGINEERING CORPORATION
|
2026-02-01
|
China Taiwan
|
4568 Kgs
|
5 WDC
|
|
5
|
EXDO6810976769
|
WAFER EFEM HTS:
|
N/A
|
E&R ENGINEERING CORPORATION
|
2026-01-29
|
China Taiwan
|
10538 Kgs
|
8 WDC
|
|
6
|
EXDO6810976767
|
Q-PANEL LASER MARKING HTS:
|
N/A
|
E&R ENGINEERING CORPORATION
|
2026-01-29
|
China Taiwan
|
14243 Kgs
|
10 WDC
|
|
7
|
EXDO6810976285
|
POWER RACK PUMP OF PLASMAX CLEAN HTS:
|
N/A
|
E&R ENGINEERING CORPORATION
|
2026-01-24
|
China Taiwan
|
7090 Kgs
|
7 WDC
|
|
8
|
YASVKHH0096328
|
E&R WAFER BACKSIDE MARKER WB- AGMAIN BODY? SETE&R WAFER BACKSIDE MARKER WB- AGLASER HEAD WITH ACCESSORIES ? SETE&R WAFER BACKSIDE MARKER WB- AGCOOLING UNIT ? SETE&R WAFER BACKSIDE MARKER WB- AGEXHAUST SYSTEM X SET
|
N/A
|
E&R ENGINEERING CORPORATION
|
2025-12-30
|
China Taiwan
|
3942 Kgs
|
4 WDC
|
|
9
|
MLCWTPEH10019237
|
PO NO.: 152671 CARVER TOOL#38 WB-300AG SINGLE LASER BACKSIDE MARKER MODEL: WB-300AG PRODUCT NAME: WAFER BACKSIDE LASER HS CODE: 8486.40
|
N/A
|
E&R ENGINEERING CORPORATION
|
2025-07-30
|
China
|
4075 Kgs
|
5 CAS
|
|
10
|
NXGWKHHCVG69905
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
INTEL C/O RINCHEM
|
E&R ENGINEERING CORPORATION
|
2025-01-21
|
China Taiwan
|
3511 Kgs
|
2 WDC
|