Hp Inc. C/o Inventec (Chongqing)

Name: Hp Inc. C/o Inventec (Chongqing) | See Recent Shipments | ImportGenius
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US Customs records for Hp Inc. C/o Inventec (Chongqing), a supplier based in China.

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Total Shipments

2,325

Trading Partners

Top Partner

IEC TECHOLOGIES, S. DE R.L. DE C.V.

Ports

Top Port

Los Angeles, California

Contact Info

Hp Inc. C/o Inventec (Chongqing)

Ltd. No. 66 West District 2nd Rd Shapingba District, Chongqing 401331 China

Hp Inc. C/o Inventec (Chongqing) Records

Get a complete supplier history

Updated: 2026-03-29

Total shipments from 2006-11-01 to 2026-03-30

Precise data and chart data points are only available to paid subscribers

Supplier Shipments

Top Trading Partners

Legend

Top Ports

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Los Angeles, California
Long Beach, California
Miami, Florida
Savannah, Georgia
New York/Newark Area, Newark, New Jersey

Total shipments from 2006-11-01 to 2026-03-30

Precise data and chart data points are only available to paid subscribers

Supplier Shipments

#	Bill of Lading	Product	Importer	Supplier	Arrival Date	Country of Origin	Gross Weight KGS	Quantity
1	CMDUSHZ7880663	ASSEMBLY,CASE,TOP,NRJ, ASSEMBLY,TOP,THICK RJ,KEYBOARD,SUB,PCB ASSEMBLY,CASE,TOP,NRJ, ASSEMBLY,MODULE,REAR,DISPLAY,WLAN,P,IM ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON PART NO:, H H H H H H PO : INV:H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY:HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-29	China	6328 Kgs	444 CTN
2	CMDUSHZ7915569	PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,I/O,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,I/O,L,FR,HALOGEN FREE+ ROHS PCB,BT MODULE,L,FR,HALOGEN FREE+ ROHS PCB,BT MODULE,L,FR,HALOGEN FREE+ ROHS PCB,TOUCH CTRL,L,HDI, PCB,MB,L,HDI,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,.X.X.MM,FR,HALO PCB,ACS,L,FR,HALOGEN FREE+ ROHS PCB,TOPSUP,L,FR,HALOGEN FREE+ ROHS PCB,TRANS,L,FR,HALOGEN FREE+ ROHS PCB,SC,L,.X.X.MM,FR,HALOGEN FRPCB,ECOM,L,.XX.MM,FR,HALOGEN FRE PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,.X.X.MM,FR,HALO PCB,ACS,L,FR,HALOGEN FREE+ ROHS PCB,TOPSUP,L,FR,HALOGEN FREE+ ROHS PCB,TRANS,L,FR,HALOGEN FREE+ ROHS KEYBOARD,,PVCY BL,P,BLACK,USA,.SPEAKER.W/HOUSING,OHM,W,X,.X. SPEAKER.W/HOUSING,OHM,W,X,.X. KEYBOARD,,PVCY BL,P,BLACK,USA,. GASKET,SHIELDING,LZF-D/MP,ADHESIVE PAD,MM,MM,MM,FSL-BSNA KEYBOARD,,TOUCHPAD BUTTON,.X., SPEAKER.W/HOUSING,OHM,W,X,.X SPEAKER.W/HOUSING,OHM,W,X,.X.SPEAKER.W/HOUSING,OHM,W,X,.X. PAD,THERMAL,MM,MM,.MM,DENKA FSL- PAD,THERMAL,TP,GRAPHITE,K=W/MK, FRAME,KEYBOARD,PC+ABS TALC,US,P SPEAKER.W/HOUSING,OHM,.W,X,.X SPEAKER.W/HOUSING,OHM,W,X,.X. SPEAKER.W/HOUSING,OHM,W,X,.X. FAN,BLOWER, .MM,V,CCW,PWM,WIRE,THERMAL MODULE,INTEL ARL,UMA,W,CHIPSET DIODE,ESD,.V,SMD,SLPPXJ,TR IC,SYNC STEP-DOWN REGULATOR,QFN-,P,T IC,SYNC STEP-DOWN REGULATOR,. .V,. IC,LED DRIVER,. .V,IC,SON,P,TR CONNECTOR,FPC,BACK FLIP,./.MM,FL,. CAPACITOR-CHIP,UF,V,M,XR,,TR,. RESISTOR-CHIP,.,+/- ,/W,,TR,+RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,K,+/- ,/W,,TAP RES-CHIP-.K- -/W--TAP RESISTOR-CHIP,.,+/- ,/W,,TR INDUCTOR,.UH, ,KHZ,A,.XXM BEAD,OHM, ,A,.OHM,INCH,INDUCTOR,.UH,+- ,KHZ,A,X.X INDUCTOR,UH,+/- ,MHZ,MA,.X.X INDUCTOR,.UH, ,KHZ,.A,.X.X INDUCTOR,.UH, ,KHZ,.A,XX.M BEAD,OHM, ,MA,.OHM,MM,M IC,SEQUENCE CONTROLLER, .V,QFN,P,TR IC,BUFFER,ONE N INV,X-DFN-,P,TR IC,ANALOG MUX/DEMUX,X- DFN-,P,TRRES-CHIP-- -/W--TAP IC,USB TYPE-C PORT PROTECTOR,. .V,ES CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,UF,V,M,XR,,TR,. CAPACITOR-CHIP,UF,.V,M,XR,,TR CAPACITOR-CHIP,UF,V,M,XR,,TR CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,.UF,V,K,XR,,TRCAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,UF,V,K,XR,,TR CAPACITOR-CHIP,UF,.V,M,XR,,TR, CAPACITOR-CHIP,UF,V,K,XR,,TR CAPACITOR-CHIP,UF,V,M,XR,,TR CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,.UF,.V,K,XR,,TR, CAPACITOR-CHIP,.UF,.V,K,XR,,TRIC,LED DRIVER,. .V,IC,SON,P,TR CONNECTOR,FPC,BACK FLIP,./.MM,FL,. CONNECTOR,USB. GEN ,TYPE A,-./. SOCKET,PCIEX KEY B NGFF,P,.MM,GOLD, CAP-CHIP--K,V-XR--TAP CAPACITOR-CHIP,PF,V,D,NP,,TR,. CAPACITOR-CHIP,.UF,V,K,XR,,TR, CAPACITOR-CHIP,UF,V,K,XR,,TR,.CAPACITOR-CHIP,.UF,.V,M,XR,,TR CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,UF,V,M,XR,,TR,. CAPACITOR-CHIP,UF,V,M,XR,,TR,. RESISTOR-CHIP,.,+/- ,/W,,TR,+ RESISTOR-CHIP,,+/- ,/W,,TR,+/- RESISTOR-CHIP,K, ,/W,,TRRESISTOR-CHIP,M, ,/W,,TR RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,.,+/- ,/W,,TR RESISTOR-CHIP,.K, ,/W,,TAP RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,K,+/- ,/W,,TAP BEAD,OHM, ,A,.OHM,INCH, INDUCTOR,.UH,+- ,KHZ,A,.X.INDUCTOR,.UH,+- ,MHZ,A,.X.X INDUCTOR,.UH, ,KHZ,.A,XX.M IC,SYNC STEP-DOWN REGULATOR,. .V,. RES-CHIP-- -/W--TAP CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,UF,V,M,XR,,TR,. CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,.UF,V,K,XR,,TR,CAPACITOR-CHIP,UF,.V,M,XR,,TR, CAPACITOR-CHIP,UF,V,K,XR,,TR CAPACITOR-CHIP,UF,V,M,XR,,TR CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,PF,V,J,CG,,TR CAPACITOR-CHIP,PF,V,K,XR,,TRCAPACITOR-CHIP,PF,V, ,CG,,TR, CAPACITOR-CHIP,.UF,V,K,XS,,TR, DUMMY,SMART CARD,TOP,PC+ABS+ TALC,W HOLDER,TOP,IO L,PC+ABS TALC,P BUTTON,TOP,FINGER PRINTS,PCFRE DUMMY,SIM,PC+ABS+ TALC,METEOR SILVER, THERMAL MODULE,INTEL ARL H,UMA,W,CHI TRAY,NANO SIM,RAL T,GLACIER SILVERSHIELD,CAN DDR,WWAN,SUS ,W THERMAL MODULE,INTEL ARL,DIS,W,.W,C THERMAL MODULE,INTEL ARL,DIS,W,.W,C PCB,SC,L,.X.X.MM,FR,HALOGEN FR PCB,ECOM,L,.XX.MM,FR,HALOGEN FRE PCB,LAN,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,FR,HALOGEN FREE+ ROHSPCB,ACS,L,.X.X.MM,FR,HALOGEN F PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,BOT,L,FR,HALOGEN FREE+ ROHS PCB,TOP,L,FR,HALOGEN FREE+ ROHS ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON PART NO: H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H PO : INV: H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY: HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-29	China	9450 Kgs	781 CTN
3	CMDUSHZ7880664	FRAME,KEYBOARD,PC+ABS TALC,US,P PART NO: H PO : INV: H, HS CODE: CARTONS INTO PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO,PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY: HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-29	China	6518 Kgs	616 CTN
4	CMDUSHZ7900195	SET,HOUSING,BOTTOM GASKET,PCB CPU,LZF-D/MF,CONDUCTIVE FFC,ACS,P,X.X.MM,./.MM,PET,S CABLE,ROUND+FFC,POS,MM,I,CAMERA,AC CABLE,ROUND+FFC,POS,MM,I,CAMERA,AC CABLE,ROUND+FPC+FFC,POS,MM,I,WEBCAM CABLE,ROUND,POS,MM,I,EDP,NONTOUCH, FAN,BLOWER, MM,.CFM,.PA,V, KEYBOARD,,TOUCHPAD BUTTON,.X., FFC,FPR,P,.XX.MM,./.MM,PET,G FFC,SMART CARD,P,X.X.MM,./. CABLE,ROUND,POS,MM,I,MB FAN,BLOWER, .MM,V,CCW,PWM,WIRE, FAN,BLOWER, . .MM,V,.A,CCW,PWM FAN,BLOWER, . .MM,V,.A,CW,PWM,FAN,BLOWER,. . .MM,.CFM, THERMAL MODULE,INTEL ARL-HX,MR NVIDIA, CABLE,ROUND+FFC,POS,MM,I,CAMERA,ACS THERMAL MODULE,INTEL ARL H,UMA,W,CHI FAN,BLOWER,. . .MM,.CFM, FAN,BLOWER, MM,.CFM,PA,V,.A SET,BEZEL IR,DISPLAY,P PART NO:H H H H H H H H H H H H H H H H H H H H H H HPO : INV: H H H H H H H H H H H H H H H H H HH H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY:HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-24	China	8492 Kgs	610 CTN
5	CMDUSHZ7900197	SET,HOUSING,BOTTOM CABLE,ROUND,POS,MM,I,EDP,NONTOUCH CABLE,ROUND,POS,MM,I,EDP,TOP,PRIVAC THERMAL MODULE,INTEL ARL U,UMA,W,CHI THERMAL MODULE,INTEL ARL,UMA,W,CHIPSET HINGE-W BRACKET,DISPLAY,LEFT,. .KGF- HINGE-W BRACKET,DISPLAY,RIGHT,. .KGF, CABLE,ROUND+FFC,POS,MM,I,CAMERA,ACS CABLE,ROUND+FFC,POS,MM,I,CAMERA,AC CABLE,ROUND,POS,MM,I,EDP,NONTOUCH,F CABLE,ROUND,POS,MM,I,EDP,TOP,FHD CABLE,ROUND+FFC,POS,MM,I,CAMERA,ACS CABLE,ROUND+FPC,POS,MM,I,EDP,NONTOU CABLE,ROUND+FPC,POS,MM,I,EDP,TOP,FH CABLE,ROUND+FPC,POS,MM,I,EDP,PRIVACTHERMAL MODULE,INTEL LNL,UMA,W,DOWNWAR CABLE,ROUND+FPC,POS,MM,I,EDP,NONTOU MODULE,NFC CARTON,DC,PSI,BC,CG,MM,MM,MM PART NO: H H H H H H H H HH H H H H H H H H H H H H H PO : INV: H H HH H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY:HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-24	China	7313 Kgs	408 CTN
6	CMDUSHZ7895318	SET,COVER,TOP,PCR SET,HOUSING,BOTTOM DIB,VGA ADAPTOR,HDMI SET,BEZEL RGB,DISPLAY,W SET,BEZEL RGB,DISPLAY,W SET,BEZEL,DISPLAY,,RGB SET,OLED FRAME,DISPLAY,, SET,FRAME,DISPLAY,P,OLED SET,BEZEL RGB,DISPLAY,W SET,AC RING,MALTA,WHITE SET,BEZEL RGB,DISPLAY,W SET,MALTA,BRACKET SET,BEZEL SET,POWER,BUTTON SET,A COVER SET,LOGO,PLATE SET,A COVER,DOOR,NHSET,POGO,RING,WHITE TOUCH PAD,NO BUTTON,P,X,GLACIER S PART NO: H H H H H H H H H H H H H H HH H H H PO : INV: H H H H H H H H H H H H H H HH H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY:HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-24	China	6873 Kgs	491 CTN
7	CMDUSHZ7895316	SET,COVER,TOP,PCR SET,HOUSING,BOTTOM PART NO: H H PO :, INV: H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALSALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY:HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-24	China	6355 Kgs	388 CTN
8	CMDUSHZ7895313	ASSEMBLY,TOP,THIN,KEYBOARD,SUB,RJ,W ASSEMBLY,TOP,THICK,KEYBOARD,SUB,RJ,W ASSEMBLY,CASE,REAR,DISPLAY,WLAN,AG PCB,HUB,L,.XX.MM,FR,HALOGEN FRE PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,BT MODULE,L,FR,HALOGEN FREE+ ROHS, PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,MIC,L,FR,HALOGEN FREE+ ROHS PCB,KB,L,FR,HALOGEN FREE+ ROHS PCB,DISPLAY-I,L,FR,HALOGEN FREE+ ROHS PCB,SMART CARD,L,FR,HALOGEN FREE+ ROHSPCB,SD CARD,L,FR,HALOGEN FREE+ ROHS PCB,TRANS,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,FR,HALOGEN FREE+ ROHS PCB,SC,L,.X.X.MM,FR,HALOGEN FR PCB,ECOM,L,.XX.MM,FR,HALOGEN FRE PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,I/O,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHSPCB,ACS,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,.X.X.MM,FR,HALOGEN F PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,BOT,L,FR,HALOGEN FREE+ ROHS PCB,TOP,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,MICRO VIA PCB,TRANSFER,L,FR,MICRO VIA PCB,KB TRANS,L,FR,UVIASPCB,USB LAN,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,.X.XMM,FR,HALOGE PCB,MIC,L,XXMM,FR,HALOGEN FREE+ PCB,PWR BUTTON,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,.X.X.MM,FR,HALO PCB,ACS,L,FR,HALOGEN FREE+ ROHSPCB,TOPSUP,L,FR,HALOGEN FREE+ ROHS PCB,TRANS,L,FR,HALOGEN FREE+ ROHS SET,BEZEL,DISPLAY,,IR SET,BEZEL,DISPLAY,,IR SET,BEZEL,DISPLAY,W,IR SET,BEZEL,DISPLAY,W,IR SET,BEZEL,DISPLAY,W,IR SET,BEZEL IR,DISPLAY,WASSEMBLY,CASE,DISPLAY,KIT,METEOR ASSEMBLY,WACOM,PEN,X ASSEMBLY,WACOM,PEN,X ASSEMBLY,MODULE,REAR,DISPLAY,WWAN PCB, ASSEMBLY,WACOM,PEN,KIT,X PART NO: H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H PO : INV:H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY: HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-24	China	10219 Kgs	571 CTN
9	CMDUSHZ7867261	DUMMY,THM,PC+ABS TALC,P FOAM,LIGHTBAR,CR- SHIELD,TOP,CU FOIL DUMMY,SIM,PC+ABS+ TALC,METEOR SILVER, GASKET,NI/CU PPW FOF,MM,.MM,.MM,REC THERMAL MODULE,INTEL ARL,UMA,W,CHIPSET DUMMY,SMART CARD,TOP,PC+ABS+ TALC,, HOOK,PCB,MIDDLE,POM M-,LOCK COVER,CABLE,PC+ABS TALC BUTTON,BOTTOM COVER,PC+ABS+ TALC HOOK,PCB,MIDDLE,POM M-,LOCK,MODULE, HOLDER,TOP,IO L,PC+ABS TALC,W SHIELD,ASIDE,ABSORBER,DST-,,MYLAR HOLDER,TOP,IO R,PC+ABS TALC,P BUTTON,TOP FPR,PC,PPAD,THERMAL,KEYBOARD,GRAPHITE,K=MK/W SHIELD,BSIDE,ABSORBER,DST-,,MYLAR FINGER,SPRING,BLUETOOTH,MODULE,TITANIUM STANDOFF,FF,M.,.MM,.MM,RND,SN,. SPEAKER.W/HOUSING,OHM,.W,X,. PLATE,DISPLAY BEZEL,TRIM L,PC,PARKER PLATE,DISPLAY BEZEL,TRIM R,PC,P PAD,THERMAL,MM,MM,.MM,FSL-BSNA,WGASKET,PCB CPU,LZF-D/MF,CONDUCTIVE GASKET,PCB CPU,LZF-D/MF,CONDUCTIVE GASKET,LZF-D/MF,MM,.MM,.MM,C PAD,THERMAL,MM,MM,.MM,FSL-BS FOAM,LIGHTBAR,CR- SHIELD,ASIDE,ABSORBER,DST-,,MYLAR,AU GASKET,BOTTOM,POWER,MC ASSEMBLY,CASE,BOTTOM,W/O RJ,PASSEMBLY,HOLDER,PCB ASSEMBLY,CASE,BOTTOM,SUB,NRJ THICK-, PART NO: H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H PO :INV: H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY:HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-10	China	10501 Kgs	700 CTN
10	CMDUSHZ7867259	FRAME,KEYBOARD,PC+ABS TALC,US,P FRAME,TOP,KEYBOARD,PC+ABS+ TALC,US THERMAL MODULE,INTEL ARL H,UMA,W,CHI INDUCTOR,.UH,+/- ,KHZ,A,.X. ASSEMBLY,CASE,BOTTOM,W/O RJ,P PART NO: H H, H H H PO : INV: H HH H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY:HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2026-03-10	China	6647 Kgs	561 CTN

#	Importer	Last Address	Most Recent	No. of Containers	Gross Weight KGS
1	IEC TECHOLOGIES, S. DE R.L. DE C.V.	Los Angeles, California	2026-03-29	1104	5573973 Kgs
2	HP INC. C/O XPOLOGISTICS	Los Angeles, California	2024-01-14	800	6746123 Kgs
3	IEC TECHOLOGIES, S. DE R.L. DE C.	Long Beach, California	2025-07-06	248	865193 Kgs
4	HP INC.C/O RYDER LOGISTICS	Los Angeles, California	2018-12-08	58	569469 Kgs
5	HP INC. C/O RYDER LOGISTICS INDY	Long Beach, California	2024-01-14	25	235019 Kgs

#	Supplier	Last Address	Most Recent

More data available to paid subscribers

Sample Shipment From Hp Inc. C/o Inventec (Chongqing)

Bill of Lading CMDUSHZ7880663

Arrival Date: 2026-03-29

Container Number: UETU7911736

Cargo #1
Description ASSEMBLY,CASE,TOP,NRJ, ASSEMBLY,TOP,THICK RJ,KEYBOARD,SUB,PCB ASSEMBLY,CASE,TOP,NRJ, ASSEMBLY,MODULE,REAR,DISPLAY,WLAN,P,IM ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON PART NO: H H H H H H PO : INV: H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY: HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM --
Keywords assembly case top nrj assembly top thick rj keyboard sub pcb assembly module rear display wlan	HS-Code DATA UNAVAILABLE	Piece Count 444

Length 480	Height 108
Width 96	Load Status Loaded
Seal M9306280	Equipment Description CN
Type 40 Foot Dry Container, Opening at one or both end	Type of Service Pier to Pier
Container Type 40 Foot Dry Container, Opening at one or both end	Marks & Numbers N/M

Carrier COMPAGNIE MARITIME D-AFFRETEMENT	Carrier Code CMDU
Carrier Address 5701 LAKE WRIGHT DR	Carrier Contact Number DATA UNAVAILABLE
Ship Registered In DATA UNAVAILABLE	Foreign Port YANTIAN
Voyage Number 0P501	Country of Origin CHINA
Vessel Name CMA CGM LA SCALA	U.S. Port DATA UNAVAILABLE
Master Bill of Lading CMDUSHZ7880663	Weight (LB/KG) 13953.24 / 6328
Quantity 444 CTN	Container Count 1
Place of Receipt YANTIAN	Distribution Port DATA UNAVAILABLE
House-v-Master DATA UNAVAILABLE	Measurement DATA UNAVAILABLE
In-Bond Entry-Type 61	Bill Type Code In-bond Automated