|
1
|
DMALLYGA14953
|
EPOXY MOLDING COMPOUND / SENSITECH (TEMPTALE )
|
KYOCERA AVX COMPONENTS(BIDDEFORD)
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2026-01-20
|
South Korea
|
519 Kgs
|
25 PKG
|
|
2
|
TERDLP202511041
|
EPOXY MOLDING COMPOUND TEMPERATURE-CONTROLLED- C VENTCLOSED
|
KYOCERA AVX COMPONENTS
|
HYSOL HUAWEI ELECTRONICS CO., LTD
|
2025-12-30
|
China
|
643 Kgs
|
2 PKG
|
|
3
|
DMALLYGA13539
|
EPOXY MOLDING COMPOUND / TEMPERATURE RECORDER
|
KYOCERA AVX COMPONENTS(BIDDEFORD)
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2025-06-24
|
China
|
2227 Kgs
|
9 PKG
|
|
4
|
TERDLP2504041
|
EPOXY MOLDING COMPOUND TEMPERATURE RECORDER
|
KYOCERA AVX COMPONENTS CORPORTATION
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2025-05-20
|
China
|
373 Kgs
|
1 PKG
|
|
5
|
GLVVGL2409017060
|
EPOXY MOLDING COMPOUND
|
KYOCERA AVX COMPONENTS
|
HYSOL HUAWEI ELECTRONICS CO.,LTD.
|
2024-09-28
|
China
|
437 Kgs
|
1 PKG
|
|
6
|
DFDSTAO7174238
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2024-01-25
|
China
|
12516 Kgs
|
17 PKG
|
|
7
|
CHQFHQD23120273
|
EPOXY MOLDING COMPOUND
|
CAPLINQ AMERICAS, INC
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2024-01-23
|
China
|
1065 Kgs
|
2 PKG
|
|
8
|
DMALLYGA09728
|
EPOXY MOLDING COMPOUND / TEMPTALE USB AMBIENT 16K
|
KYOCERA AVX COMPONENTS(BIDDEFORD)
|
HYSOL HUAWEI ELECTRONICS CO LTD
|
2023-08-30
|
China
|
2623 Kgs
|
11 PKG
|
|
9
|
DFDSTAO7156901
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2023-08-19
|
China
|
12101 Kgs
|
16 PKG
|
|
10
|
DFDSTAO7151333
|
EPOXY MOLDING COMPOUND,TEMP:-21'C ,VENT:CLOSED
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2023-06-08
|
China
|
7700 Kgs
|
11 PKG
|