|
1
|
DMALLYGA16304
|
EPOXY MOLDING COMPOUND
|
KYOCERA AVX COMPONENTS(BIDDEFORD)
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2026-07-17
|
China
|
1922 Kgs
|
7 PKG
|
|
2
|
TERDLP202606055
|
EPOXY MOLDING COMPOUND
|
KYOCERA AVX COMPONENTS
|
HYSOL HUAWEI ELECTRONICS CO., LTD
|
2026-07-03
|
China
|
747 Kgs
|
2 PKG
|
|
3
|
TERDLP202604020
|
EPOXY MOLDING COMPOUND TEMPERATURE-CONTROLLED-18C VENTCLOSED
|
KYOCERA AVX COMPONENTS
|
HYSOL HUAWEI ELECTRONICS CO., LTD
|
2026-05-15
|
South Korea
|
1120 Kgs
|
4 PKG
|
|
4
|
DMALLYGA14953
|
EPOXY MOLDING COMPOUND / SENSITECH (TEMPTALE )
|
KYOCERA AVX COMPONENTS(BIDDEFORD)
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2026-01-20
|
South Korea
|
519 Kgs
|
25 PKG
|
|
5
|
TERDLP202511041
|
EPOXY MOLDING COMPOUND TEMPERATURE-CONTROLLED- C VENTCLOSED
|
KYOCERA AVX COMPONENTS
|
HYSOL HUAWEI ELECTRONICS CO., LTD
|
2025-12-30
|
China
|
643 Kgs
|
2 PKG
|
|
6
|
DMALLYGA13539
|
EPOXY MOLDING COMPOUND / TEMPERATURE RECORDER
|
KYOCERA AVX COMPONENTS(BIDDEFORD)
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2025-06-24
|
China
|
2227 Kgs
|
9 PKG
|
|
7
|
TERDLP2504041
|
EPOXY MOLDING COMPOUND TEMPERATURE RECORDER
|
KYOCERA AVX COMPONENTS CORPORTATION
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2025-05-20
|
China
|
373 Kgs
|
1 PKG
|
|
8
|
GLVVGL2409017060
|
EPOXY MOLDING COMPOUND
|
KYOCERA AVX COMPONENTS
|
HYSOL HUAWEI ELECTRONICS CO.,LTD.
|
2024-09-28
|
China
|
437 Kgs
|
1 PKG
|
|
9
|
DFDSTAO7174238
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2024-01-25
|
China
|
12516 Kgs
|
17 PKG
|
|
10
|
CHQFHQD23120273
|
EPOXY MOLDING COMPOUND
|
CAPLINQ AMERICAS, INC
|
HYSOL HUAWEI ELECTRONICS CO., LTD.
|
2024-01-23
|
China
|
1065 Kgs
|
2 PKG
|