|
1
|
NNRG17610061241
|
SILICON EPI WAFERSSILICON POLISHED WAFERSHS C
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2026-01-28
|
Japan
|
555 Kgs
|
48 CTN
|
|
2
|
EXDO6930215052
|
CARTONS BOXES HTS:
|
MEMC CORPORATION
|
MEMC JAPAN LTD.
|
2026-01-09
|
Japan
|
1405 Kgs
|
775 CTN
|
|
3
|
FTNVTYS000004197
|
SILICON POLISHED WAFERSDOPED FOR USE IN ELECTRONICS INDUSTRYHS CODE
|
RAMCO TECHNOLOGY, INC.
|
MEMC JAPAN
|
2026-01-04
|
Japan
|
1350 Kgs
|
120 BOX
|
|
4
|
NNRG17610059935
|
SILICON EPI WAFERSSILICON POLISHED WAFERSHS C
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2025-12-16
|
Japan
|
810 Kgs
|
72 CTN
|
|
5
|
NNRG17610059010
|
SILICON EPI WAFERSSILICON POLISHED WAFERSHS C
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2025-11-19
|
Japan
|
1376 Kgs
|
120 CTN
|
|
6
|
NNRG17610058263
|
SILICON POLISHED WAFERS, DOPED FORUSE IN ELEC
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2025-10-21
|
Japan
|
1804 Kgs
|
152 CTN
|
|
7
|
DMALTYOA64168
|
ROLLERA.,MAIN[S/N:9NL-A00-1U00](PART NUMBER:X570LA07C00A)HS CODE:8486.90BOX,MR[S/N:9NL-A00-3A90](PART NUMBER:X570LA02C001)HS CODE:4415.10
|
GLOBALWAFERS AMERICA CO., LTD.
|
MEMC JAPAN LTD
|
2025-02-06
|
Japan
|
270 Kgs
|
1 CAS
|
|
8
|
FTNVTYS000003861
|
S05QXB1ES0I100199 300MM DONOR FALLOUTTHS CODE381800
|
RAMCO TECHNOLOGY, INC.
|
MEMC JAPAN
|
2025-01-13
|
Japan
|
1350 Kgs
|
120 BOX
|
|
9
|
NNRG17610046603
|
300MM EPI PP+ 1-0-0 0.005-0.010 SILICON EPI WAFERS, DOPED FOR USE IN ELECTRONICS INDUSTRY
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2024-10-03
|
Japan
|
1380 Kgs
|
120 CTN
|
|
10
|
NNRG17610045093
|
300MM EPI PP+ 1-0-0 0.005-0.010 SILICON EPI WAFERS, DOPED FOR USE IN ELECTRONICS INDUSTRY
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2024-08-24
|
Japan
|
1370 Kgs
|
120 CTN
|