|
1
|
DSVFK5L9000402
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2026-04-15
|
Malaysia
|
2343 Kgs
|
5 PKG
|
|
2
|
DSVFK5L9000021
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2026-04-01
|
Malaysia
|
4518 Kgs
|
257 PKG
|
|
3
|
DSVFKUL9102065
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2025-12-08
|
Singapore
|
4643 Kgs
|
9 PKG
|
|
4
|
DSVFKUL9100818
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2025-11-08
|
Malaysia
|
4643 Kgs
|
9 PKG
|
|
5
|
DSVFKUL9099868
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2025-09-18
|
Singapore
|
5066 Kgs
|
291 CAN
|
|
6
|
DSVFKUL9097375
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2025-07-10
|
Singapore
|
4643 Kgs
|
267 CAN
|
|
7
|
DSVFKUL9091085
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2024-12-09
|
Singapore
|
4643 Kgs
|
267 CAN
|
|
8
|
DSVFKUL9090248
|
EPOXY MOLDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2024-11-22
|
Singapore
|
1921 Kgs
|
110 CAN
|
|
9
|
DSVFKUL9084803
|
EPOXY MOULDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2024-08-02
|
Singapore
|
6034 Kgs
|
343 CAN
|
|
10
|
DSVFKUL9079982
|
EPOXY MOULDING COMPOUND
|
INFINEON TECHNOLOGIES AMERICAS CORP
|
SHIN ETSU ELECTRONICS (M) SDN BHD
|
2024-02-26
|
Malaysia
|
5554 Kgs
|
319 CAN
|