|
1
|
FTNVSHKGS0004193
|
MULTILAYER CERAMIC CAPACITORHSCODE:853224001 PALLET SAID TO CONTAIN 23 CARTONSTHIS SHPMENT DOES NOT CONTAIN WOODEN PACKAGING MATERIALS
|
CAL-CHIP ELECTRONICS INC
|
FENG HUA ADVANCED TECHNOLOGY (HK) L
|
2026-07-16
|
Hong Kong
|
114 Kgs
|
23 CTN
|
|
2
|
FTNVSTPES0008251
|
7 CARDBOARD SLEEVES2PLT=48CTNHS CODE:4819.20
|
CAL-CHIP ELECTRONICS INC
|
LEON TECHNOLOGIES INC
|
2026-07-15
|
China Taiwan
|
867 Kgs
|
48 CTN
|
|
3
|
FTNVSICNS0000979
|
MULTI-LAYER CERAMIC CAPACITOR
|
CAL-CHIP ELECTRONICS INC
|
H S COLTD
|
2026-07-14
|
South Korea
|
734 Kgs
|
81 PKG
|
|
4
|
FTNVSSINS0001349
|
CHIP/CAP - MULTILAYER, FIXED, LEADNESS
|
CAL-CHIP ELECTRONICS INC
|
MACROCOMPONENT (S) PTE LTD
|
2026-07-10
|
Singapore
|
244 Kgs
|
27 CTN
|
|
5
|
FTNVSTPES0008182
|
MULTILAYER CHIP CAPACITOR4 PLTS=143 CTNS
|
CAL-CHIP ELECTRONICS INC
|
WALSIN TECHNOLOGY CORPORATION
|
2026-06-28
|
China Taiwan
|
1219 Kgs
|
4 PAL
|
|
6
|
FTNVSBKKS0001147
|
FIXED RESISTORS
|
CAL-CHIP ELECTRONICS INC
|
ROYAL ELECTRONIC FACTORY(THAILAND)C
|
2026-06-19
|
Thailand
|
425 Kgs
|
31 CTN
|
|
7
|
FTNVSICNS0000899
|
MULTI LAYER CERAMIC CAPACITOR FERRITE BEAD
|
CAL-CHIP ELECTRONICS INC
|
H S COLTD
|
2026-06-12
|
South Korea
|
150 Kgs
|
21 PKG
|
|
8
|
FTNVSTPES0008040
|
MULTILAYER CHIP CAPACITORINV NO.:910885014 9108850233 PLTS=111 CTNSHS CODE: 8532.24
|
CAL-CHIP ELECTRONICS INC
|
WALSIN TECHNOLOGY CORPORATION
|
2026-06-12
|
China Taiwan
|
868 Kgs
|
3 CTN
|
|
9
|
FTNVSTPES0007996
|
CHIP CAPATITORHS CODE:8532.24
|
CAL-CHIP ELECTRONICS INC
|
HSIN BUNG INTERNATIONAL CO LTD
|
2026-06-12
|
China Taiwan
|
306 Kgs
|
36 CTN
|
|
10
|
FTNVSSINS0001329
|
CHIP/CAP - MULTILAYER, FIXED, LEADN
|
CAL-CHIP ELECTRONICS INC
|
MACROCOMPONENT (S) PTE LTD
|
2026-06-11
|
Singapore
|
1199 Kgs
|
133 CTN
|