|
1
|
FTNVSHKGS0004193
|
MULTILAYER CERAMIC CAPACITORHSCODE:853224001 PALLET SAID TO CONTAIN 23 CARTONSTHIS SHPMENT DOES NOT CONTAIN WOODEN PACKAGING MATERIALS
|
CAL-CHIP ELECTRONICS,INC.
|
FENG HUA ADVANCED TECHNOLOGY (HK) L
|
2026-07-16
|
Hong Kong
|
114 Kgs
|
23 CTN
|
|
2
|
FTNVSHKGS0004057
|
MULTILAYER CERAMIC CAPACITOR HS CODE: 85322400INDUCTORHS CODE: 850450002 PALLETS SAID TO CONTAIN 78 CARTONSTHIS SHIPMENT DOES NOT CONTAIN WOODEN PACKAGING MATERIALS
|
CAL-CHIP ELECTRONICS,INC.
|
FENG HUA ADVANCED TECHNOLOGY (HK) L
|
2026-06-11
|
Hong Kong
|
552 Kgs
|
78 CTN
|
|
3
|
FTNVSHKGS0003876
|
MULTILAYER CERAMIC CAPACITOR HS CODE: 853224009 PALLETS SAID TO CONTAIN 315 CARTONSTHIS SHIPMENT DOES NOT CONTAIN WOODEN PACKAGING MATERIALS
|
CAL-CHIP ELECTRONICS,INC.
|
FENG HUA ADVANCED TECHNOLOGY (HK) L
|
2026-05-17
|
Hong Kong
|
2494 Kgs
|
315 CTN
|
|
4
|
FTNVSHKGS0003713
|
MULTILAYER CERAMIC CAPACITOR HS CODE: THIS SHIPMENT DOES NOT CONTAIN WOO DEN PACKAGING MATERIALS
|
CAL-CHIP ELECTRONICS,INC.
|
FENG HUA ADVANCED TECHNOLOGY (HK) L
|
2026-04-21
|
Hong Kong
|
502 Kgs
|
67 CTN
|
|
5
|
FTNVSHKGS0003615
|
MULTILAYER CERAMIC CAPACITOR HS CODE:
|
CAL-CHIP ELECTRONICS,INC.
|
FENG HUA ADVANCED TECHNOLOGY (HK) L
|
2026-03-22
|
Hong Kong
|
287 Kgs
|
42 CTN
|