|
1
|
NXGWTYODMR93586
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S.E.H.AMERICA,INC.
|
SHIN ETSU HANDOTAI COMPANY LIMITED
|
2026-06-04
|
Japan
|
11437 Kgs
|
943 CTN
|
|
2
|
NXGWTYODMP45473
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S.E.H.AMERICA,INC.
|
SHIN ETSU HANDOTAI COMPANY LIMITED
|
2026-06-01
|
Japan
|
5785 Kgs
|
476 CTN
|
|
3
|
NXGWTYODLW50181
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S.E.H.AMERICA,INC.
|
SHIN ETSU HANDOTAI COMPANY LIMITED
|
2026-05-15
|
Japan
|
2882 Kgs
|
236 CTN
|
|
4
|
NXGWTYODLS26463
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S.E.H.AMERICA,INC.
|
SHIN ETSU HANDOTAI COMPANY LIMITED
|
2026-05-12
|
Japan
|
5683 Kgs
|
455 CTN
|
|
5
|
KWEO550141760570
|
USED PACKING ARTICLES USED FOSB
|
S.E.H AMERICA, INC.
|
SK HYNIX INC.
|
2026-05-08
|
South Korea
|
4310 Kgs
|
42 PKG
|
|
6
|
KWEO111040101290
|
MATERIALS FOR SEMICONDUCTOR (3923.10)
|
S.E.H. AMERICA INC.
|
SHIN-ETSU POLYMER CO., LTD.
|
2026-05-07
|
Japan
|
7966 Kgs
|
1620 PCS
|
|
7
|
KWEO550141763510
|
USED HY BOX
|
S.E.H. AMERICA INC.
|
SHIN WON TECH. CO., LTD.
|
2026-05-05
|
South Korea
|
3780 Kgs
|
84 PKG
|
|
8
|
KWEO113042171385
|
ACTUATOR PHOTO SENSOR (9031.90)
|
SEH AMERICA, INC.
|
MICRO ENGINEERING INC.
|
2026-05-05
|
Japan
|
148 Kgs
|
12 CTN
|
|
9
|
KWEO146040068843
|
CZ PARTS (6815.19)
|
SEH AMERICA, INC.
|
TOYO TANSO CO., LTD.
|
2026-05-05
|
Japan
|
341 Kgs
|
7 CTN
|
|
10
|
KWEO144040020764
|
WAFER MAKING MACHINE (9013.20)
|
SEH AMERICA, INC.
|
KOBELCO RESEARCH INSTITUTE INC.
|
2026-05-05
|
Japan
|
24 Kgs
|
4 CTN
|