|
1
|
KWEO111040106072
|
SILICON SQUARE COLUMN (3926.90)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-07-24
|
Japan
|
1559 Kgs
|
289 CTN
|
|
2
|
KWEO111040107446
|
SILICON WAFER (3818.00)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-07-24
|
Japan
|
2262 Kgs
|
121 PKG
|
|
3
|
NXGWTYODPA03261
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-07-18
|
Japan
|
3770 Kgs
|
312 CTN
|
|
4
|
KWEO111040125156
|
CARDBOARD BOX (3926.90)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-07-11
|
Japan
|
2090 Kgs
|
450 CTN
|
|
5
|
KWEO111040105335
|
SILICON WAFER (3818.00)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-07-11
|
Japan
|
4506 Kgs
|
138 PKG
|
|
6
|
KWEO111040103843
|
PLASTICS (3923.10)
|
SEH AMERICA INC M/S SEH AMERICA INC
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-07-11
|
Japan
|
8256 Kgs
|
80 PKG
|
|
7
|
NXGWTYODNL30315
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-07-05
|
Japan
|
2900 Kgs
|
240 CTN
|
|
8
|
KWEO111040105324
|
SILICON WAFER DOPED (3818.00)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-07-05
|
Japan
|
5876 Kgs
|
100 PKG
|
|
9
|
KWEO111040125145
|
CARDBOARD BOX (3926.90)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-06-28
|
Japan
|
363 Kgs
|
75 CTN
|
|
10
|
KWEO111040105313
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-06-28
|
Japan
|
1891 Kgs
|
87 PKG
|