|
1
|
KWEO111040077151
|
CARDBOARD BOX (.)
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-04-20
|
Japan
|
258 Kgs
|
48 CTN
|
|
2
|
KWEO111040100940
|
SILICON WAFER DOPED (.)
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-04-20
|
Japan
|
4976 Kgs
|
161 PKG
|
|
3
|
NXGWTYODKZ97051
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-04-20
|
Japan
|
14500 Kgs
|
1200 CTN
|
|
4
|
KWEO111040099455
|
PLASTICS (.)
|
SEH AMERICA INC M/S SEH AMERICA INC
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-04-13
|
Japan
|
8256 Kgs
|
80 PKG
|
|
5
|
KWEO111040100030
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (.)
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-04-10
|
Japan
|
5373 Kgs
|
90 PKG
|
|
6
|
KWEO111040099046
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (.)
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-03-31
|
Japan
|
5085 Kgs
|
180 PKG
|
|
7
|
NXGWTYODKG16503
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-03-24
|
Japan
|
5800 Kgs
|
480 CTN
|
|
8
|
KWEO111040099035
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (.)
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-03-24
|
Japan
|
2071 Kgs
|
83 PKG
|
|
9
|
KWEO111040076941
|
CARDBOARD BOX (.)
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-03-24
|
Japan
|
177 Kgs
|
50 CTN
|
|
10
|
KWEO111040081421
|
PLASTICS (.)
|
SEH AMERICA INC M/S SEH AMERICA INC
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-03-18
|
Japan
|
8256 Kgs
|
80 PKG
|