|
1
|
NXGWTYODMR93586
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-06-04
|
Japan
|
11437 Kgs
|
943 CTN
|
|
2
|
KWEO111040103143
|
SILICON WAFER DOPED (3818.00)
|
N/A
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-06-04
|
Japan
|
5537 Kgs
|
44 PKG
|
|
3
|
KWEO111040124961
|
CARDBOARD BOX (2804.61)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-06-01
|
Japan
|
451 Kgs
|
61 CTN
|
|
4
|
NXGWTYODMP45473
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-06-01
|
Japan
|
5785 Kgs
|
476 CTN
|
|
5
|
KWEO111040103132
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-06-01
|
Japan
|
4579 Kgs
|
122 PKG
|
|
6
|
NXGWTYODLW50181
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-05-15
|
Japan
|
2882 Kgs
|
236 CTN
|
|
7
|
KWEO111040077173
|
CARDBOARD BOX (3926.90)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-05-15
|
Japan
|
274 Kgs
|
75 CTN
|
|
8
|
KWEO111040104473
|
SILICON WAFER DOPED (3818.00)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-05-15
|
Japan
|
4196 Kgs
|
174 PKG
|
|
9
|
KWEO111040100973
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00)
|
N/A
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2026-05-12
|
Japan
|
5383 Kgs
|
72 PKG
|
|
10
|
NXGWTYODLS26463
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2026-05-12
|
Japan
|
5683 Kgs
|
455 CTN
|