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1
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NXGWTYODKN02124
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
DISCO HI-TEC AMERICA,INC
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DISCO CORPORATION.
|
2026-04-18
|
South Korea
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9076 Kgs
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12 PKG
|
|
2
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KMGMOSAG12227500
|
FULLY AUTOMATIC DIE SEPARATOR MODEL NO. DDS SERIAL NO. BR UNIT
|
DISCO HI-TEC AMERICA,INC
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DISCO CORPORATION
|
2026-04-11
|
Japan
|
1964 Kgs
|
2 SKD
|
|
3
|
NXGWTYODKX21214
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
OPTO DIODE AN ITW COMPANY.
|
DISCO CORPORATION.
|
2026-04-10
|
Japan
|
1899 Kgs
|
3 CTN
|
|
4
|
NXGWTYODKJ02066
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
DISCO HI-TEC AMERICA,INC
|
DISCO CORPORATION
|
2026-04-10
|
Japan
|
121 Kgs
|
1 PKG
|
|
5
|
NXGWTYODKL35686
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
DISCO HI-TEC AMERICA,INC
|
DISCO CORPORATION.
|
2026-04-02
|
Japan
|
708 Kgs
|
2 CTN
|
|
6
|
NXGWTYODKB09751
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
DISCO HI-TEC AMERICA,INC
|
DISCO CORPORATION.
|
2026-03-17
|
Japan
|
1990 Kgs
|
5 CTN
|
|
7
|
NXGWTYODJB78184
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
DISCO HI-TEC AMERICA,INC
|
DISCO CORPORATION.
|
2026-02-21
|
Japan
|
680 Kgs
|
1 CTN
|
|
8
|
HLCUTYOPL02466AA
|
FULLY AUTOMATIC DICING SAW MODEL NO. DFD SERIAL NO. NLD UNIT FULLY AUTOMATIC LASER SAW MODEL NO. DFL SERIAL NO. PA, UNIT HS CODE SKIDS ( CARTONS) CARTONS
|
MICROSS ADVANCED INTERCONNECT TECH
|
DISCO CORPORATION
|
2026-02-03
|
China
|
5348 Kgs
|
7 PCS
|
|
9
|
DSVFTYO8313496
|
( STEEL CASES & PLASTIC CASE)MODEL:DFG SHEETSERIAL NO.TS
|
INTEL C/O RINCHEM
|
DISCO CORPORATION
|
2026-01-27
|
Japan
|
660 Kgs
|
2 CAS
|
|
10
|
HLCUTYOPK05298AA
|
FULLY AUTOMATIC IN-FEED SURFACE GRINDER MODEL NO. DFG SERIAL NO. JL UNIT AUTOMATIC DICING SAW MODEL NO. DAD, SERIAL NO. TL UNIT HS CODE . PACKAGES ( STEEL CASE & SKIDS( CARTONS)) PACKAGES
|
MICROSS ADVANCED INTERCONNECT TECH
|
DISCO CORPORATION
|
2026-01-14
|
China
|
4669 Kgs
|
4 PCS
|