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1
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NXGWTYODLP64254
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CHEMICAL PRODUCTS.N.E.S.
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DISCO HI-TEC AMERICA,INC.
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DISCO, INC
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2026-06-05
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Japan
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1248 Kgs
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100 PKG
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|
2
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NXGWTYODLR97144
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MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
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DISCO HI-TEC AMERICA,INC.
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DISCO, INC
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2026-05-20
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Japan
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513 Kgs
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1 PKG
|
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3
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NXGWTYODLP64184
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CHEMICAL PRODUCTS.N.E.S.
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DISCO HI-TEC AMERICA,INC.
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DISCO, INC
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2026-05-20
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Japan
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2488 Kgs
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200 PKG
|
|
4
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NXGWTYODLG39071
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MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
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DISCO HI-TEC AMERICA,INC.
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DISCO, INC
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2026-05-17
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South Korea
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2110 Kgs
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4 PKG
|
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5
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NXGWTYODLH13934
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MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
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DISCO HI-TEC AMERICA,INC.
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DISCO, INC
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2026-05-14
|
South Korea
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14358 Kgs
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14 PKG
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6
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NXGWTYODKN02124
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MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
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DISCO HI-TEC AMERICA,INC.
|
DISCO, INC
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2026-04-18
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South Korea
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9076 Kgs
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12 PKG
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|
7
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KMGMOSAG12227500
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FULLY AUTOMATIC DIE SEPARATOR MODEL NO. DDS SERIAL NO. BR UNIT
|
DISCO HI-TEC AMERICA,INC.
|
DISCO, INC
|
2026-04-11
|
Japan
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1964 Kgs
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2 SKD
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8
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NXGWTYODKJ02066
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
DISCO HI-TEC AMERICA, INC.
|
DISCO, INC
|
2026-04-10
|
Japan
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121 Kgs
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1 PKG
|
|
9
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NXGWTYODKL35686
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MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
DISCO HI-TEC AMERICA,INC.
|
DISCO, INC
|
2026-04-02
|
Japan
|
708 Kgs
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2 CTN
|
|
10
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NXGWTYODKB09751
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MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
|
DISCO HI-TEC AMERICA,INC.
|
DISCO, INC
|
2026-03-17
|
Japan
|
1990 Kgs
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5 CTN
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