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| Description Chất trợ hàn dùng trong quá trình hàn bản mạch điện thoại di động (Solder paste Indium SAC305 INDIUM 8.9HFA TYPE 4.5 87.75%); Hàng mới 100%; 2FSN-KB0205 ; HMC00-0001 | |
| HS-Code 38101000 | Incoterms DAP |